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dc.contributor.authorBušek, David
dc.contributor.authorRadev, Radoslav
dc.contributor.authorMach, Pavel
dc.date.accessioned2012-07-31T10:22:12Z
dc.date.available2012-07-31T10:22:12Z
dc.date.issued2007-05
dc.identifier.citationBušek, D. - Radev, R. - Mach, P. Can Conductive Adhesives With Nanoparticles Beat Commonly Used Electrically Conductive Adhesives Without Nanoparticles. In: ISSE 2007 [CD-ROM]. New York: IEEE Press, 2007, p. 7-11. ISBN 978-1-4244-1217-4.cze
dc.identifier.urihttp://hdl.handle.net/10467/12386
dc.description.abstractThis paper deals with electrically conductive adhesives (ECA's) with isotropic properties (ICA's) and describes the way of improving the quality parameters of such electrically conductive joint. This paper discusses the advantages and disadvantages of nanoparticle addition into commonly fabricated electrically conductive adhesive. Electrical parameters of ICA joints before and after mechanical, humid and humid-heat stress is applied, are observed. Standard controlling and evaluating principles for ECAs are based on resistance measurement of a joint; this paper shows that nonlinearity evaluation is more sensitive. For some applications, linearity might have crucial importance and an absolute size of resistance might not be so crucial. Our previous work proves that nonlinearity might not just be more sensitive but that it also does not have to progress in the same way as the resistivity (Busek, D. and Mach, P.).eng
dc.language.isocescze
dc.publisherIEEEcze
dc.rights© 2007 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.eng
dc.titleCan Conductive Adhesives With Nanoparticles Beat Commonly Used Electrically Conductive Adhesives Without Nanoparticlescze
dc.typepříspěvek z konference - elektronickýcze
dc.identifier.doi10.1109/ISSE.2007.4432812


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