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dc.contributor.authorDuraj, Aleš
dc.contributor.authorBušek, David
dc.contributor.authorMlích, Andrej
dc.date.accessioned2012-07-30T13:31:33Z
dc.date.available2012-07-30T13:31:33Z
dc.date.issued2007-05
dc.identifier.citationDuraj, A. - Mach, P. - Mlích, A. Measurement of Nonlinearity as a Diagnostic Tool for Quality Determination of Lead-Free. In: ISSE 2007 [CD-ROM]. New York: IEEE Press, 2007, p. 134-138. ISBN 978-1-4244-1217-4.cze
dc.identifier.urihttp://hdl.handle.net/10467/12384
dc.description.abstractAt present there are directions RoHS-WEEE in European Union which restrict the use of certain hazardous substances in new electric and electronic products. Therefore mass usage of lead-free soldering in electronic production started. A typical alloy for lead-free soldering is based on Sn, Ag and Cu (SAC). For the most of types of lead-free solders is necessary to use technological process of soldering in reduced oxygen concentration atmosphere for improvement of wettability of soldered surfaces. Quality of these soldered joints is evaluated according of their electrical and mechanical properties. This paper is focused on measurement of nonlinearity, electrical resistance and mechanical strength. Especially evaluation of nonlinearity as a diagnostic tool for the prediction of solder joints reliability has been tested. Also effect of different surface finish of PCBs and influence of reduced oxygen concentration on quality of joints has been examined.eng
dc.language.isocescze
dc.publisherIEEEcze
dc.rights© 2007 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.eng
dc.titleMeasurement of Nonlinearity as a Diagnostic Tool for Quality Determination of Lead-Free Solder Jointscze
dc.typepříspěvek z konference - elektronickýcze
dc.identifier.doi10.1109/ISSE.2007.4432834


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Zobrazit minimální záznam