Dušek, K. - Urbánek, J. - Mach, P. - Drápala, J. Wetting Force Measurement of the Different Types of Solders and Testing Materials. In: ISSE 2007 [CD-ROM]. New York: IEEE Press, 2007, p. 167-170. ISBN 978-1-4244-1217-4.
We have used one of the most commonly used wetability evaluation methods -wetting balance (meniscograph) method to measure the wetting force. We have made a modification of the measuring equipment to measure a less quantity of the solder. We have measured a combination of different types of the lead and lead-free solders and different types of the testing materials. The measurement was carried out on nine different types of solders (Sn63Pb37, Sn95Sb5, Sn95Sb3,5Cul,5, Sn96Ag4, Sn95,5Ag3,8Cu0,7, Sn97Bi2Cul, Sn97Cu3, Sn99Cul, Sn99,75), three types of testing materials (copper, nickel and brass) and three types of fluxes. All measurements nine solders ware measured in ambient atmosphere and two lead-free solders were (Sn96Ag4, Sn95,5Ag3,8CuO,7) measured in inert atmosphere. The results of measurements we classified into the table according to he shape of wetting curve and according to the visual control.
