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dc.contributor.authorDuraj, Aleš
dc.contributor.authorMach, Pavel
dc.date.accessioned2012-07-30T12:45:47Z
dc.date.available2012-07-30T12:45:47Z
dc.date.issued2006-05
dc.identifier.citationDuraj, A. - Mach, P. Diagnostic Tools for Evaluation of the Quality of the Anisotropic Conductive Adhesive Joints. In: 29th International Spring Seminar on Electronics Technology [CD-ROM]. New York: IEEE, 2006, p. 88-92. ISBN 978-1-4244-0550-3.cze
dc.identifier.urihttp://hdl.handle.net/10467/12381
dc.description.abstractIsotropic and anisotropic electrically conductive adhesives (ICAs and AC As) are materials for special applications in electronic assembly. Quality of these adhesive joints is evaluated according of their electrical and mechanical properties. This paper is focused on evaluation of quality of Anisotropic Conductive Adhesives. Especially dependence of electrical resistance, noise and nonlinearity on bonding pressure is the main purpose of this research. Effect of curing (bonding) pressure ofACA was also analyzed with scanning electron microscope (SEM). Also influence of three different types of surface finishes (Cu, Cu+Sn, Cu+Ni/Au) of printed circuit boards has been examined and then evaluated effects on measured parameters.eng
dc.language.isocescze
dc.publisherIEEEcze
dc.rights© 2006 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.eng
dc.titleDiagnostic Tools for Evaluation of the Quality of the Anisotropic Conductive Adhesive Jointscze
dc.typepříspěvek z konference - elektronickýcze
dc.identifier.doi10.1109/ISSE.2006.365373


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