Prohlížení Fakulta elektrotechnická dle autora "Mach, Pavel"
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Analysis and Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesives
Autor: Duraj, Aleš; Mach, Pavel
(IEEE, 2008-05)Anisotropic conductive adhesives (ACAs) and anisotropic conductive films (ACFs) are promising solder alternatives. These materials are preferable for fine pitch and ultra-fine pitch connections in electronics assembly. ... -
Can Conductive Adhesives With Nanoparticles Beat Commonly Used Electrically Conductive Adhesives Without Nanoparticles
Autor: Bušek, David; Radev, Radoslav; Mach, Pavel
(IEEE, 2007-05)This paper deals with electrically conductive adhesives (ECA's) with isotropic properties (ICA's) and describes the way of improving the quality parameters of such electrically conductive joint. This paper discusses the ... -
Comparison of Different Approaches of Manufacturing Process Optimization
Autor: Mach, Pavel; Barto, Seba
(IEEE, 2010-09)There are many process variables, which more or less influence quality of a manufacturing process, and there are many parameters of a product, which constitute its quality. The control of variables of a manufacturing process ... -
Degradation of Adhesive Bonds with Short Current Pulses
Autor: Mach, Pavel; Ješ, Josef; Papež, Václav
(IEEE, 2003-05)Degradation of adhesive bonds powered by rectangular very short current pulses of the width of 1 μs and frequency of 1 kHz of high amplitude has been examined. The amplitudes of the pulses have been 5 and 10 A. Power ... -
Design of Experiments of AlN Reactive Sputtering
Autor: Mach, Pavel; Kolářová, Jana
(IEEE, 2009-05)Reactive sputtering has been used for fabrication of AlN films. The process has been investigated in two levels of power of a generator, in two levels of the working pressure and in two levels of the working gas flow. The ... -
Diagnostic Tools for Evaluation of the Quality of the Anisotropic Conductive Adhesive Joints
Autor: Duraj, Aleš; Mach, Pavel
(IEEE, 2006-05)Isotropic and anisotropic electrically conductive adhesives (ICAs and AC As) are materials for special applications in electronic assembly. Quality of these adhesive joints is evaluated according of their electrical and ... -
Electrically Conductive Adhesive Filled with Mixture of Silver Nano and Microparticles
Autor: Mach, Pavel; Radev, Radoslav; Pietriková, Alena
(IEEE, 2008-09)Electrically conductive adhesive with isotropical electrical conductivity modified with addition of silver nanoparticles has been investigated. The electrical resistance, nonlinearity of a current vs. voltage characteristic ... -
Electrically Loaded Adhesive Bonds Formed on Different Surfaces
Autor: Mach, Pavel; Radev, Radoslav
(IEEE, 2007-05)Bonds of three types of electrically conductive adhesives with isotropic electrical conductivity have been formed on three types of surfaces - Cu; immerse Au and Sn (HAL). Epoxy resin types of adhesives with Ag flakes have ... -
Equipment for measurement of nonlinearity of nominally linear components
Autor: Mach, Pavel; Papež, Václav; Bušek, David; Duraj, Aleš
(IEEE, 2006-05)Nonlinearity of a nominally linear component is a significant parameter, which informs about the difference of and investigated component from an ideal one. The higher is quality of the nominally linear component; the lower ... -
Fabrication of AI203 and AIN thin films by reactive sputtering and its optimization using DOE
Autor: Mach, Pavel; Kolářová, Jana
(IEEE, 2004-05)Thin films of Al2O3 and AlN have been fabricated by reactive sputtering using magnetron sputtering equipment. A mixture of Ar and O2 has been used for the fabrication of Al2O3 films, and a mixture of Ar and N2 has been ... -
Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering
Autor: Mach, Pavel; Duraj, Aleš
(IEEE, 2008-05)There are many methods usable for production process optimization. The paper describes the use of failure mode and effects analysis (FMEA of a process type) for the process of lead-free soldering improvement. The schedule ... -
Frequency Dependence of Impedance of Adhesive Joints
Autor: Mach, Pavel; Papež, Václav; Duraj, Aleš
(IEEE, 2006-09)Electrically conductive adhesives have, in comparison with solders, significantly higher non-homogeneity of the structure, and therefore stability of electrical as well as mechanical properties of adhesive joints is lower ... -
Impedance of Adhesive Joints
Autor: Mach, Pavel; Kolář, Jiří
(IEEE, 2009-09)Impedance of adhesive joints has been measured in frequency range 20 Hz - 1 MHz using LCR meter HP 4284A. The joints have been created by adhesive assembly of jumpers on test PCBs. It has been found that the joint impedance ... -
Influence of Carbon Nanotubes Added to a Commercial Adhesive
Autor: Bušek, David; Mach, Pavel
(IEEE, 2009-05)This paper describes the influence of carbon nanotubes onto electrical properties of electrically conductive adhesives. This work is related to our previous research that described electrical connection network within ... -
Influence of Curing Process Parameters on Quality of Electrically Conductive Joints
Autor: Barto, Seba; Mach, Pavel
(IEEE, 2010-05)Curing parameters of electrically conductive adhesives are the temperature and the time. These parameters are recommended by a manufacturer of adhesive. The goal of the work is to find which of these parameters is more ... -
Influence of High Current Load on Electrical Properties of Adhesive Conductive Joints
Autor: Duraj, Aleš; Mach, Pavel; Radev, Radoslav; Matějec, Jan
(IEEE, 2006-09)Isotropic and anisotropic electrically conductive adhesives (ICAs and ACAs) are alternative materials for substitution of common used tin-lead solders in electronic assembly. Electrically conductive adhesives are potential ... -
Influence of trimming of resistive thick films on nonlinearity of their current vs. voltage characteristics
Autor: Mach, Pavel; Svasta, Pavel
(IEEE, 2004-05)Investigation of changes of nonlinearity of thick resistive films, trimmed by laser and by grinding, has been carried out. Laser trimming has been realized by an Ar laser, mechanical trimming by grinding of the layer by a ... -
Modeling of Evaporation of Thin Films Using DOE
Autor: Mach, Pavel; Kocián, Miroslav
(IEEE, 2006-05)Evaporation of thin films is widely spread technology. The goal of the work has been to optimize a process of fabrication of thin resistive Ni films. Mathematical models for calculation of thickness and resistance of the ... -
Modification of Adhesive Joints Resistance with Current Pulses
Autor: Mach, Pavel; Bušek, David
(IEEE, 2010-05)Strips of electrically conductive adhesive were printed on a test PCB. Strips were processed by a standard curing process and then aged at the temperature of 125 oC. One group of samples was aged in an oven; the second ... -
Modification of Electrically Conductive Adhesives for Better Mechanical and Electrical Properties
Autor: Mach, Pavel; Richter, Lukáš; Pietriková, Alena
(IEEE, 2008-05)The goal of the work has been to check a possibility of improvement of electrical properties of electrically conductive adhesives with isotropic electrical conductivity to edge these properties toward to properties of ...