SOJKA, M., O. BENEDIKT, and Z. HANZÁLEK. Work-in-Progress: Determining MPSoC Layout from Thermal Camera Images. In: EMSOFT '21: Proceedings of the 2021 International Conference on Embedded Software. 2021 International Conference on Embedded Software, Virtual, 2021-10-08/2021-10-15. New York: Association for Computing Machinery, 2021. p. 39-40. ISBN 978-1-4503-8712-5. DOI 10.1145/3477244.3477619. Available from: https://dl.acm.org/doi/10.1145/3477244.3477619
In many safety-critical applications, Multi-Processor Systems-on-
Chip (MPSoC) must operate within a given thermal envelope under
harsh environmental conditions. Meeting the thermal requirements
often requires using advanced task allocation and scheduling techniques
that are guided by detailed power models. This paper introduces
a method that has the potential to simplify the creation
of such models. It constructs so-called heat maps from thermal
camera images. By comparing the heat maps of different workloads,
we identify the locations of on-chip components and the amount
of heat produced by them. We demonstrate our method on the
i.MX8QuadMax chip from NXP, where we identify the locations of
CPU clusters, bigger CPU cores, GPUs, and DRAM controllers.
eng
dc.format.mimetype
application/pdf
dc.language.iso
eng
dc.publisher
Association for Computing Machinery
dc.relation.ispartof
EMSOFT '21: Proceedings of the 2021 International Conference on Embedded Software
dc.subject
thermal camera
eng
dc.subject
MPSoC
eng
dc.subject
NXP i.MX8
eng
dc.subject
heat map
eng
dc.subject
thermal-aware
eng
dc.title
Work-in-Progress: Determining MPSoC Layout from Thermal Camera Images