Work-in-Progress: Determining MPSoC Layout from Thermal Camera Images
Type of document
stať ve sborníkuconference paper
Peer-reviewed
acceptedVersion
Author
Sojka M.
Benedikt O.
Hanzálek Z.
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openAccessMetadata
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In many safety-critical applications, Multi-Processor Systems-on-
Chip (MPSoC) must operate within a given thermal envelope under
harsh environmental conditions. Meeting the thermal requirements
often requires using advanced task allocation and scheduling techniques
that are guided by detailed power models. This paper introduces
a method that has the potential to simplify the creation
of such models. It constructs so-called heat maps from thermal
camera images. By comparing the heat maps of different workloads,
we identify the locations of on-chip components and the amount
of heat produced by them. We demonstrate our method on the
i.MX8QuadMax chip from NXP, where we identify the locations of
CPU clusters, bigger CPU cores, GPUs, and DRAM controllers.
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