CALLISTI, M. - MELLOR, B.G. - POLCAR, T.: Microstructural investigation on the grain refinement occurring in Cu-doped Ni–Ti thin films. Scripta Materialia. 2014, vol. 77, p. 52-55. ISSN 1359-6462. DOI: 10.1016/j.scriptamat.2014.01.021
The mechanism of grain refinement in Cu-doped Ni-Ti thin films have been investigated by transmission electron microscopy (TEM). Sputter deposited (Ni,Cu)-rich Ni-Ti-Cu thin films exhibited a columnar structure consisting of grains with a decreasing lateral size with increasing Cu content. Cu-rich grain boundary segregations were found to become prominent in films containing higher Cu contents. These segregations were attributed to a non-polymorphic crystallisation process which lowered the grain growth rate in relation to the Cu content in the films.
