Procházení katedra elektrotechnologie dle data publikování
Zobrazují se záznamy 21-40 z 292
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Stability of Electrical Resistance of Isotropic Conductive Adhesives within Mechanical Stress
(IEEE, 2006-09)This work is focused on investigation of influence of dynamic mechanical load (bending of testing boards) on resistance of the adhesive joints. The load has been induced by a definite deflection of testing boards (fiberglass ... -
Measurement of Nonlinearity as a Diagnostic Tool for Quality Determination of Lead-Free Solder Joints
(IEEE, 2007-05)At present there are directions RoHS-WEEE in European Union which restrict the use of certain hazardous substances in new electric and electronic products. Therefore mass usage of lead-free soldering in electronic production ... -
Electrically Loaded Adhesive Bonds Formed on Different Surfaces
(IEEE, 2007-05)Bonds of three types of electrically conductive adhesives with isotropic electrical conductivity have been formed on three types of surfaces - Cu; immerse Au and Sn (HAL). Epoxy resin types of adhesives with Ag flakes have ... -
Statistical Inspection of a Workplace for Adhesive Assembly
(IEEE, 2007-05)Quality of a workplace for adhesive assembly has been examined using acceptance sampling. The goal of the work has been to find our whether dispensing of electrically conductive adhesive makes forming of adhesive joints ... -
Can Conductive Adhesives With Nanoparticles Beat Commonly Used Electrically Conductive Adhesives Without Nanoparticles
(IEEE, 2007-05)This paper deals with electrically conductive adhesives (ECA's) with isotropic properties (ICA's) and describes the way of improving the quality parameters of such electrically conductive joint. This paper discusses the ... -
Wetting Force Measurement of the Different Types of Solders and Testing Materials
(IEEE, 2007-05)We have used one of the most commonly used wetability evaluation methods -wetting balance (meniscograph) method to measure the wetting force. We have made a modification of the measuring equipment to measure a less quantity ... -
Reliability of Reverse Properties of Power Semiconductor Devices: Influence of Surface Dielectric Layer and its Experimental Verification
(2008)Reliability of reverse properties of power semiconductor devices is an important condition for their practical application. Usual standard tests do not reveal total information concerning the technological genetic aspects ... -
Modification of Electrically Conductive Adhesives for Better Mechanical and Electrical Properties
(IEEE, 2008-05)The goal of the work has been to check a possibility of improvement of electrical properties of electrically conductive adhesives with isotropic electrical conductivity to edge these properties toward to properties of ... -
Microstructure Analysis and Measurement of Nonlinearity of Vapour Phase Reflowed Solder Joints
(IEEE, 2008-05)The goal of the study is to compare quality of lead-free vapour phase reflowed solder joints soldered on different printed circuit board (PCB) surface finishes. The solder joints quality comparison is based on evaluation ... -
Electrical Connection Network Within an Electrically Conductive Adhesive
(IEEE, 2008-05)This paper deals with the connection network in isotropically conductive adhesives (ICAs). The reader will learn about conductive network creation, tunneling effect, possible ways of modeling the conductive network and ... -
Analysis and Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesives
(IEEE, 2008-05)Anisotropic conductive adhesives (ACAs) and anisotropic conductive films (ACFs) are promising solder alternatives. These materials are preferable for fine pitch and ultra-fine pitch connections in electronics assembly. ... -
Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering
(IEEE, 2008-05)There are many methods usable for production process optimization. The paper describes the use of failure mode and effects analysis (FMEA of a process type) for the process of lead-free soldering improvement. The schedule ... -
Electrically Conductive Adhesive Filled with Mixture of Silver Nano and Microparticles
(IEEE, 2008-09)Electrically conductive adhesive with isotropical electrical conductivity modified with addition of silver nanoparticles has been investigated. The electrical resistance, nonlinearity of a current vs. voltage characteristic ... -
Testing of Techniques for Improvement of Conductivity of Electrically Conductive Adhesives
(IEEE, 2008-09)The paper presents methods, which have been used for improvement of electrical conductivity of electrically conductive adhesives with isotropical electrical conductivity. Conductivity level depends, among other things, on ... -
Design of Experiments of AlN Reactive Sputtering
(IEEE, 2009-05)Reactive sputtering has been used for fabrication of AlN films. The process has been investigated in two levels of power of a generator, in two levels of the working pressure and in two levels of the working gas flow. The ... -
The Ontology based FMEA of Lead Free Soldering Process
(IEEE, 2009-05)Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the area of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools suitable for our intention ... -
Influence of Carbon Nanotubes Added to a Commercial Adhesive
(IEEE, 2009-05)This paper describes the influence of carbon nanotubes onto electrical properties of electrically conductive adhesives. This work is related to our previous research that described electrical connection network within ... -
Preparation of Electrically Conductive Adhesives Modified with AgNO3
(IEEE, 2009-05)The goal of the work has been to find if addition of Ag+ ions into electrically conductive adhesive can improve its electrical conductivity. Ag+ ions can aggregate and form additional conductive bridges between filler ... -
Impedance of Adhesive Joints
(IEEE, 2009-09)Impedance of adhesive joints has been measured in frequency range 20 Hz - 1 MHz using LCR meter HP 4284A. The joints have been created by adhesive assembly of jumpers on test PCBs. It has been found that the joint impedance ... -
Structure and properties of plasma sprayed BaTiO3 coatings
(Elsevier, 2010)Plasma spraying enables to create layers with thickness in a millimeter range adhering on various substrates. This paper provides a study of electric and mechanical properties of BaTiO3 coatings prepared by atmospheric ...