Prohlížení Fakulta elektrotechnická dle autora "Radev, Radoslav"
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Can Conductive Adhesives With Nanoparticles Beat Commonly Used Electrically Conductive Adhesives Without Nanoparticles
Autor: Bušek, David; Radev, Radoslav; Mach, Pavel
(IEEE, 2007-05)This paper deals with electrically conductive adhesives (ECA's) with isotropic properties (ICA's) and describes the way of improving the quality parameters of such electrically conductive joint. This paper discusses the ... -
Electrically Conductive Adhesive Filled with Mixture of Silver Nano and Microparticles
Autor: Mach, Pavel; Radev, Radoslav; Pietriková, Alena
(IEEE, 2008-09)Electrically conductive adhesive with isotropical electrical conductivity modified with addition of silver nanoparticles has been investigated. The electrical resistance, nonlinearity of a current vs. voltage characteristic ... -
Electrically Loaded Adhesive Bonds Formed on Different Surfaces
Autor: Mach, Pavel; Radev, Radoslav
(IEEE, 2007-05)Bonds of three types of electrically conductive adhesives with isotropic electrical conductivity have been formed on three types of surfaces - Cu; immerse Au and Sn (HAL). Epoxy resin types of adhesives with Ag flakes have ... -
Influence of High Current Load on Electrical Properties of Adhesive Conductive Joints
Autor: Duraj, Aleš; Mach, Pavel; Radev, Radoslav; Matějec, Jan
(IEEE, 2006-09)Isotropic and anisotropic electrically conductive adhesives (ICAs and ACAs) are alternative materials for substitution of common used tin-lead solders in electronic assembly. Electrically conductive adhesives are potential ...