SOJKA, M., et al. Testbed for thermal and performance analysis in MPSoC systems. In: Proceedings of the 2020 Federated Conference on Computer Science and Information Systems, FedCSIS 2020. 15th Federated Conference on Computer Science and Information Systems, Sofia, 2020-09-06/2020-09-09. Institute of Electrical and Electronics Engineers, Inc., 2020. p. 683-692. vol. 21. ISSN 2300-5963. ISBN 978-83-955416-7-4. DOI 10.15439/2020F174. Available from: https://annals-csis.org/proceedings/2020/drp/pdf/174.pdf
Many modern computing platforms in the safety-critical domains are based on heterogeneous Multiprocessor System-on-Chip (MPSoC). Such computing platforms are expected to guarantee high-performance within a strict thermal envelope. This paper introduces a testbed for thermal and performance analysis. The testbed allows the users to develop advanced scheduling and resource allocation techniques aiming at finding an optimal trade-off between the peak temperature and the achieved performance. This paper presents a new, open-source Thermobench tool for data collection and analysis of user-defined workloads. Furthermore, a methodology for shortening the time needed for the data collection is proposed. Experiments show that a significant amount of time can be saved. Specifically, time reduction from 60 minutes to 15 minutes is achieved with the i.MX8 MPSoC from NXP while running a set of user-defined benchmarks that stress CPU, GPU, and different levels of the memory hierarchy.
eng
dc.format.mimetype
application/pdf
dc.language.iso
eng
dc.publisher
Institute of Electrical and Electronics Engineers, Inc.
dc.relation.ispartof
Proceedings of the 2020 Federated Conference on Computer Science and Information Systems, FedCSIS 2020
dc.subject
Many-Core
eng
dc.subject
Multi-Core Processor
eng
dc.subject
International Sociological Association
eng
dc.title
Testbed for thermal and performance analysis in MPSoC systems