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dc.contributor.authorPovolotskaya , E.
dc.contributor.authorMach , P.
dc.date.accessioned2017-02-08T11:53:15Z
dc.date.available2017-02-08T11:53:15Z
dc.date.issued2012
dc.identifier.citationActa Polytechnica. 2012, vol. 52, no. 2.
dc.identifier.issn1210-2709 (print)
dc.identifier.issn1805-2363 (online)
dc.identifier.urihttp://hdl.handle.net/10467/66928
dc.description.abstractThis paper introduces a formulation of appropriate risk estimation methods that can be used for improving of processes in the electronics area. Two risk assessment methods have been chosen with regard to the specifics of adhesive joining based on electrically conductive adhesives. The paper provides a combination of a failure mode and effect analysis (FMEA) and fault tree analysis (FTA) for optimizing of the joining process. Typical features and failures of the process are identified. Critical operations are found and actions for avoiding failures in these actions are proposed. A fault treehas been applied to the process in order to get more precise information about the steps and operations in the process, and the relations between these operations. The fault tree identifies potential failures of the process. Then the effects of the failures have been estimated by the failure mode and effect analysis method. All major differences between failure mode and effect analysis and fault tree analysis are defined and there is a discussion about how to use the two techniquescomplement each other and achieve more efficient results.en
dc.format.mimetypeapplication/pdf
dc.language.isoeng
dc.publisherČeské vysoké učení technické v Prazecs
dc.publisherCzech Technical University in Pragueen
dc.relation.ispartofseriesActa Polytechnica
dc.relation.urihttps://ojs.cvut.cz/ojs/index.php/ap/article/view/1530
dc.rightsCreative Commons Attribution 4.0 International Licenseen
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/
dc.subjectfailure mode and effect analysisen
dc.subjectfault tree analysisen
dc.subjectadhesive joiningen
dc.subjectelectrically conductive adhesivesen
dc.titleFMEA and FTA Analyses of the Adhesive Joining Process using Electrically Conductive Adhesives
dc.typearticleen
dc.date.updated2017-02-08T11:53:15Z
dc.rights.accessopenAccess
dc.type.statusPeer-reviewed
dc.type.versionpublishedVersion


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Except where otherwise noted, this item's license is described as Creative Commons Attribution 4.0 International License