Prohlížení Acta Polytechnica. 2016, vol. 56, no. 2 dle autora "Koleňák , Roman"

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    • ULTRASONIC SOLDERING OF Cu AND Al2O3 CERAMICS BY USE OF Bi-La AND Bi-Ag-La SOLDERS 

      Autor: Koleňák , Roman; Prach , Michal; Kostolný , Igor
      (České vysoké učení technické v PrazeCzech Technical University in Prague, 2016)
      This work deals with the effect of solder alloying with a small amount of lanthanum on joint formation with metallic and ceramic substrate. The Bi-Ag – based solder with 2 wt.% lanthanum addition and Bi solder with 2 wt.% ...