Prohlížení dle autora "Urbánek, J."

Zobrazují se záznamy 1-2 z 2

    • Flux effect on void quantity and size in soldered joints 

      Autor: Bušek, D.; Dušek, K.; Růžička, D.; Plaček, M.; Mach, P.; Urbánek, J.; Starý, J.
      (2016)
      This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes ...

    • Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys 

      Autor: Podzemský, J.; Papež, V.; Urbánek, J.; Dušek, K.
      (2012)
      During soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence ...