A Novel Quasi-Tangential Approach for High-Efficiency Laser Micromachining

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Elsevier

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Tangential and quasi-tangential laser micromachining is a substitution for conventional micro-turning processes. Its benefit lies in the forceless machining with extra high precision. On the other hand, the adjustment of process parameters and strategy is difficult to set for high material removal rates. Especially when the standard laser system with galvo scanner is used. This study analyzes tangential laser micromachining using short (nanosecond) and ultrashort (femtosecond) pulses to optimize material removal rates (MRR) and surface quality for roughing operations applied on cemented carbide. The tailored tangential micromachining approach (hybrid) was proposed as a pre-stage for adaptive control capabilities in future, which have been compared with other known approaches: standard tangential and fixed quasi-tangential micromachining. All approaches were evaluated under varying laser parameters and pulse energies. The hybrid approach revealed the highest material remove rate up to 1.54 mm³/min in burst mode. When the femtosecond laser was used the surface roughness was lower than 0.19 um.

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ČERMÁK, A., et al. A Novel Quasi-Tangential Approach for High-Efficiency Laser Micromachining. Journal of Manufacturing Processes. 2026, ISSN 2212-4616.

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Except where otherwised noted, this item's license is described as Creative Commons Attribution (CC BY) 4.0

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