The Ontology based FMEA of Lead Free Soldering Process

dc.contributor.author Molhanec, Martin
dc.contributor.author Mach, Pavel
dc.date.accessioned 2012-08-02T09:38:08Z
dc.date.available 2012-08-02T09:38:08Z
dc.date.issued 2009-05
dc.description.abstract Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the area of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools suitable for our intention are presented. Particular phases of ontology utilization for development of more exact approach to the FMEA procedure of reflow lead free soldering are analyzed. The goal of our work, a proposal of a user's guide for the FMEA procedure based on an ontology paradigm is presented. This user's guide is included in our university courses Management of Production Quality and Complex Quality Control provided by the Department of Electro-Technology of our faculty. en
dc.identifier.citation Mach, P. - Molhanec, M. The Ontology based FMEA of Lead Free Soldering Process. In: 32nd ISSE 2009 Proceedings [CD-ROM]. Brno: VUT v Brně, FEI, 2009, ISBN 978-1-4244-4260-7. cs
dc.identifier.doi 10.1109/ISSE.2009.5206998
dc.identifier.uri http://hdl.handle.net/10467/12409
dc.language.iso ces cs
dc.publisher IEEE cs
dc.rights © 2009 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. en
dc.title The Ontology based FMEA of Lead Free Soldering Process cs
dc.type conference paper en
dspace.entity.type Publication

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