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Degradation of Adhesive Bonds with Short Current Pulses
(IEEE, 2003-05)
Degradation of adhesive bonds powered by rectangular very short current pulses of the width of 1 μs and frequency of 1 kHz of high amplitude has been examined. The amplitudes of the pulses have been 5 and 10 A. Power ...
Processing of Alumina Nano-films
(IEEE, 2005-05)
There are different technologies for processing of alumina thin films. It has been found that only some of them are usable for reliable and reproducible processing of nano-films with the thickness of 2 through 3 nm. Such ...
Testing of Normality of Data Files for Application of SPC Tools
(IEEE, 2004-05)
Different types of statistical tests have been used for evaluation of the normality of selected data files. The files have been simulated to be on the border of normality. The results of the tests have been compared. It ...
Influence of Interconnection Surface Finishes on Quality of Adhesive Joints
(IEEE, 2005)
Electrically conductive adhesives electrically connect and mechanically bond circuits to a variety of substrates. Four different silver-filled isotropically conductive adhesives have been used for attaching of 1206 chip ...
Influence of trimming of resistive thick films on nonlinearity of their current vs. voltage characteristics
(IEEE, 2004-05)
Investigation of changes of nonlinearity of thick resistive films, trimmed by laser and by grinding, has been carried out. Laser trimming has been realized by an Ar laser, mechanical trimming by grinding of the layer by a ...
Influence of High Current Load on Electrical Properties of Adhesive Conductive Joints
(IEEE, 2006-09)
Isotropic and anisotropic electrically conductive adhesives (ICAs and ACAs) are alternative materials for substitution of common used tin-lead solders in electronic assembly. Electrically conductive adhesives are potential ...
Stability of Electrical Resistance of Isotropic Conductive Adhesives within Mechanical Stress
(IEEE, 2006-09)
This work is focused on investigation of influence of dynamic mechanical load (bending of testing boards) on resistance of the adhesive joints. The load has been induced by a definite deflection of testing boards (fiberglass ...
Modeling of Evaporation of Thin Films Using DOE
(IEEE, 2006-05)
Evaporation of thin films is widely spread technology. The goal of the work has been to optimize a process of fabrication of thin resistive Ni films. Mathematical models for calculation of thickness and resistance of the ...
Transformation of Data for Statistical Processing
(IEEE, 2006-05)
The use of many statistical tools depends on normality of processed data. There are different methods for transformation of non-normally distributed data sets toward to normally distributed ones. The goal of the work has ...
Diagnostics and Aging of Electrically Conductive Adhesives
(IEEE, 2000)
Resistance and nonlinearity of the current vs. voltage characteristics (NAVC) of adhesive joints was investigated. The joints were prepared of four types of electrically conductive adhesives (ECA) on Cu clad FR4 laminate ...