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Measurement of Nonlinearity as a Diagnostic Tool for Quality Determination of Lead-Free Solder Joints 

Duraj, Aleš; Bušek, David; Mlích, Andrej (IEEE, 2007-05)
At present there are directions RoHS-WEEE in European Union which restrict the use of certain hazardous substances in new electric and electronic products. Therefore mass usage of lead-free soldering in electronic production ...

Electrically Loaded Adhesive Bonds Formed on Different Surfaces 

Mach, Pavel; Radev, Radoslav (IEEE, 2007-05)
Bonds of three types of electrically conductive adhesives with isotropic electrical conductivity have been formed on three types of surfaces - Cu; immerse Au and Sn (HAL). Epoxy resin types of adhesives with Ag flakes have ...

Statistical Inspection of a Workplace for Adhesive Assembly 

Mach, Pavel; Duraj, Aleš (IEEE, 2007-05)
Quality of a workplace for adhesive assembly has been examined using acceptance sampling. The goal of the work has been to find our whether dispensing of electrically conductive adhesive makes forming of adhesive joints ...

Diagnostic Tools for Evaluation of the Quality of the Anisotropic Conductive Adhesive Joints 

Duraj, Aleš; Mach, Pavel (IEEE, 2006-05)
Isotropic and anisotropic electrically conductive adhesives (ICAs and AC As) are materials for special applications in electronic assembly. Quality of these adhesive joints is evaluated according of their electrical and ...

Electrically Conductive Adhesive Filled with Mixture of Silver Nano and Microparticles 

Mach, Pavel; Radev, Radoslav; Pietriková, Alena (IEEE, 2008-09)
Electrically conductive adhesive with isotropical electrical conductivity modified with addition of silver nanoparticles has been investigated. The electrical resistance, nonlinearity of a current vs. voltage characteristic ...

Modification of Electrically Conductive Adhesives for Better Mechanical and Electrical Properties 

Mach, Pavel; Richter, Lukáš; Pietriková, Alena (IEEE, 2008-05)
The goal of the work has been to check a possibility of improvement of electrical properties of electrically conductive adhesives with isotropic electrical conductivity to edge these properties toward to properties of ...

Impedance of Adhesive Joints 

Mach, Pavel; Kolář, Jiří (IEEE, 2009-09)
Impedance of adhesive joints has been measured in frequency range 20 Hz - 1 MHz using LCR meter HP 4284A. The joints have been created by adhesive assembly of jumpers on test PCBs. It has been found that the joint impedance ...

Can Conductive Adhesives With Nanoparticles Beat Commonly Used Electrically Conductive Adhesives Without Nanoparticles 

Bušek, David; Radev, Radoslav; Mach, Pavel (IEEE, 2007-05)
This paper deals with electrically conductive adhesives (ECA's) with isotropic properties (ICA's) and describes the way of improving the quality parameters of such electrically conductive joint. This paper discusses the ...

Microstructure Analysis and Measurement of Nonlinearity of Vapour Phase Reflowed Solder Joints 

Pietriková, A.; Mach, P.; Livovský, Ľ.; Urbančík, J. (IEEE, 2008-05)
The goal of the study is to compare quality of lead-free vapour phase reflowed solder joints soldered on different printed circuit board (PCB) surface finishes. The solder joints quality comparison is based on evaluation ...

Electrical Connection Network Within an Electrically Conductive Adhesive 

Bušek, D.; Mach, P. (IEEE, 2008-05)
This paper deals with the connection network in isotropically conductive adhesives (ICAs). The reader will learn about conductive network creation, tunneling effect, possible ways of modeling the conductive network and ...
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AutorMach, Pavel (35)Bušek, David (9)Duraj, Aleš (9)Mach, P. (6)Papež, V. (6)Ctibor, Pavel (5)Dušek, K. (5)Bušek, D. (4)Dušek, Karel (4)Papež, Václav (4)... zobrazit dalšíKlíčové slovoReliability (4)Electrical properties (3)Plasma spraying (3)Assembly manufacturing (2)Capacitors (2)Dielectric properties (2)DOE (2)DSC (2)evaporation (2)Perovskites (2)... zobrazit další

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