Browsing Publikační činnost - 13113 by Author "Mach, P."

Now showing items 1-6 of 6

    • Diagnostics and Aging of Electrically Conductive Adhesives 

      Author: Mach, P.; Škvor, M.; Száraz, P.
      (IEEE, 2000)
      Resistance and nonlinearity of the current vs. voltage characteristics (NAVC) of adhesive joints was investigated. The joints were prepared of four types of electrically conductive adhesives (ECA) on Cu clad FR4 laminate ...

    • Electrical Connection Network Within an Electrically Conductive Adhesive 

      Author: Bušek, D.; Mach, P.
      (IEEE, 2008-05)
      This paper deals with the connection network in isotropically conductive adhesives (ICAs). The reader will learn about conductive network creation, tunneling effect, possible ways of modeling the conductive network and ...

    • Flux effect on void quantity and size in soldered joints 

      Author: Bušek, D.; Dušek, K.; Růžička, D.; Plaček, M.; Mach, P.; Urbánek, J.; Starý, J.
      (2016)
      This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes ...

    • Influence of Interconnection Surface Finishes on Quality of Adhesive Joints 

      Author: Mach, P.; Bušek, D.; Duraj, A.
      (IEEE, 2005)
      Electrically conductive adhesives electrically connect and mechanically bond circuits to a variety of substrates. Four different silver-filled isotropically conductive adhesives have been used for attaching of 1206 chip ...

    • Microstructure Analysis and Measurement of Nonlinearity of Vapour Phase Reflowed Solder Joints 

      Author: Pietriková, A.; Mach, P.; Livovský, Ľ.; Urbančík, J.
      (IEEE, 2008-05)
      The goal of the study is to compare quality of lead-free vapour phase reflowed solder joints soldered on different printed circuit board (PCB) surface finishes. The solder joints quality comparison is based on evaluation ...

    • Processing of Alumina Nano-films 

      Author: Mach, P.; Rozkošný, T.
      (IEEE, 2005-05)
      There are different technologies for processing of alumina thin films. It has been found that only some of them are usable for reliable and reproducible processing of nano-films with the thickness of 2 through 3 nm. Such ...