Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys
Author
Podzemský, J.
Papež, V.
Urbánek, J.
Dušek, K.
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During soldering process intermetallic compounds
as a reaction between solder and substrate are
created. Physical properties of those compounds are different
to properties of solder and substrate. The influence of
intermetallic compounds (IMC) on radio frequency resistance
of soldered joints has been identified. Tested solders
were lead free Sn-1Cu, Sn-4Ag and Sn-3.8Ag-0.7Cu
and lead containing Sn-37Pb (all in weight percent). Samples
were annealed up to 3000 hours at 150 °C to accelerate
growing of IMC. Radio frequency measuring method
has been developed and is described. Influence of IMC on
resistance of joint is growing with growing frequency because
IMC with slightly different resistivity to base solder
is creating barrier to current. Resistance of joints has been
measured up to 3 GHz.
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