• New Packaging Concepts: Bridging Devices and Applications 

      Autor: Shiori Idaka
      (České vysoké učení technické v Praze. České centrum IET, 2021)
      New Packaging Concepts: Bridging Devices and Applications Shiori Idaka, European Research Co-operation Centre. MITSUBISHI ELECTRIC EUROPE B.V. Ratingen, Germany Abstract The performance of power modules ...