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Electrically Loaded Adhesive Bonds Formed on Different Surfaces
(IEEE, 2007-05)
Bonds of three types of electrically conductive adhesives with isotropic electrical conductivity have been formed on three types of surfaces - Cu; immerse Au and Sn (HAL). Epoxy resin types of adhesives with Ag flakes have ...
Statistical Inspection of a Workplace for Adhesive Assembly
(IEEE, 2007-05)
Quality of a workplace for adhesive assembly has been examined using acceptance sampling. The goal of the work has been to find our whether dispensing of electrically conductive adhesive makes forming of adhesive joints ...
Diagnostic Tools for Evaluation of the Quality of the Anisotropic Conductive Adhesive Joints
(IEEE, 2006-05)
Isotropic and anisotropic electrically conductive adhesives (ICAs and AC As) are materials for special applications in electronic assembly. Quality of these adhesive joints is evaluated according of their electrical and ...
Electrically Conductive Adhesive Filled with Mixture of Silver Nano and Microparticles
(IEEE, 2008-09)
Electrically conductive adhesive with isotropical electrical conductivity modified with addition of silver nanoparticles has been investigated. The electrical resistance, nonlinearity of a current vs. voltage characteristic ...
Modification of Electrically Conductive Adhesives for Better Mechanical and Electrical Properties
(IEEE, 2008-05)
The goal of the work has been to check a possibility of improvement of electrical properties of electrically conductive adhesives with isotropic electrical conductivity to edge these properties toward to properties of ...
Impedance of Adhesive Joints
(IEEE, 2009-09)
Impedance of adhesive joints has been measured in frequency range 20 Hz - 1 MHz using LCR meter HP 4284A. The joints have been created by adhesive assembly of jumpers on test PCBs. It has been found that the joint impedance ...
Can Conductive Adhesives With Nanoparticles Beat Commonly Used Electrically Conductive Adhesives Without Nanoparticles
(IEEE, 2007-05)
This paper deals with electrically conductive adhesives (ECA's) with isotropic properties (ICA's) and describes the way of improving the quality parameters of such electrically conductive joint. This paper discusses the ...
Design of Experiments of AlN Reactive Sputtering
(IEEE, 2009-05)
Reactive sputtering has been used for fabrication of AlN films. The process has been investigated in two levels of power of a generator, in two levels of the working pressure and in two levels of the working gas flow. The ...
Comparison of Different Approaches of Manufacturing Process Optimization
(IEEE, 2010-09)
There are many process variables, which more or less influence quality of a manufacturing process, and there are many parameters of a product, which constitute its quality. The control of variables of a manufacturing process ...
Thermal Ageing of Electrically Conductive Micro/Nano Adhesives
(IEEE, 2010-09)
Electrical as well as mechanical properties of electrically conductive adhesives can be modified by addition of different types of nanoparticles. It has been investigated if changes of the resistance of adhesive joints ...