Prohlížení Publikační činnost - 13113 dle autora "Hájková, L."

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    • Influence of Humidity on Voids Formation Inside the Solder Joint 

      Autor: Dušek, K.; Vlach, J.; Brejcha, M.; Hájková, L.; Žák, P.
      (2013)
      Void is defined such as blow hole in the solder joint. Voids may degrade the mechanical and conductive properties of the solder joint and thus decrease the reliability. Article deals with influence of humidity on ...