Prohlížení Publikační činnost - 13113 dle názvu

Zobrazují se záznamy 38-57 z 60

    • Phase stabilization in plasma sprayed BaTiO3 

      Autor: Ctibor, Pavel
      (2013)
      This paper presents a comparison of properties of BaTiO3 ceramics prepared by two different production methods: gas-stabilized plasma spraying (GSP) and spark plasma sintering (SPS). Samples of both materials were evaluated ...

    • Preparation of Electrically Conductive Adhesives Modified with AgNO3 

      Autor: Neznámý autor
      (IEEE, 2009-05)
      The goal of the work has been to find if addition of Ag+ ions into electrically conductive adhesive can improve its electrical conductivity. Ag+ ions can aggregate and form additional conductive bridges between filler ...

    • Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis 

      Autor: Dušek, Karel; Bušek, D.
      (2016)
      Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads. These residues may have non-conductive character and therefore in-circuit test may mark tested product as failed ...

    • Processing of Alumina Nano-films 

      Autor: Mach, P.; Rozkošný, T.
      (IEEE, 2005-05)
      There are different technologies for processing of alumina thin films. It has been found that only some of them are usable for reliable and reproducible processing of nano-films with the thickness of 2 through 3 nm. Such ...

    • Reliability of Reverse Properties of Power Semiconductor Devices: Influence of Surface Dielectric Layer and its Experimental Verification 

      Autor: Papež, Václav; Kojecký, B.; Šámal, D.
      (2008)
      Reliability of reverse properties of power semiconductor devices is an important condition for their practical application. Usual standard tests do not reveal total information concerning the technological genetic aspects ...

    • Solderability Measurement of Copper with Different Surface Finishes 

      Autor: Dušek, Karel; Novák, Michal; Mach, Pavel
      (IEEE, 2010-05)
      This article deals with solders wettability measurement of materials with different surface finishes, which are commonly used as solder pads on printed circuit board. The measurement was carried out on two type of solders ...

    • Stability of Electrical Resistance of Isotropic Conductive Adhesives within Mechanical Stress 

      Autor: Duraj, Aleš; Mach, Pavel
      (IEEE, 2006-09)
      This work is focused on investigation of influence of dynamic mechanical load (bending of testing boards) on resistance of the adhesive joints. The load has been induced by a definite deflection of testing boards (fiberglass ...

    • Statistical Inspection of a Workplace for Adhesive Assembly 

      Autor: Mach, Pavel; Duraj, Aleš
      (IEEE, 2007-05)
      Quality of a workplace for adhesive assembly has been examined using acceptance sampling. The goal of the work has been to find our whether dispensing of electrically conductive adhesive makes forming of adhesive joints ...

    • Structure and properties of plasma sprayed BaTiO3 coatings 

      Autor: Ctibor, Pavel
      (Elsevier, 2010)
      Plasma spraying enables to create layers with thickness in a millimeter range adhering on various substrates. This paper provides a study of electric and mechanical properties of BaTiO3 coatings prepared by atmospheric ...

    • Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints 

      Autor: Rudajevová, A.; Dušek, K.
      (2014)
      Undercooling and recalescence were studied using the differential scanning calorimetry (DSC) method on real electronic systems. Two solder pastes, Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5, were used for preparation of ...

    • Testing of Normality of Data Files for Application of SPC Tools 

      Autor: Mach, Pavel; Hochlová, Hana
      (IEEE, 2004-05)
      Different types of statistical tests have been used for evaluation of the normality of selected data files. The files have been simulated to be on the border of normality. The results of the tests have been compared. It ...

    • Testing of Techniques for Improvement of Conductivity of Electrically Conductive Adhesives 

      Autor: Mach, Pavel; Richter, Lukáš; Pietriková, Alena
      (IEEE, 2008-09)
      The paper presents methods, which have been used for improvement of electrical conductivity of electrically conductive adhesives with isotropical electrical conductivity. Conductivity level depends, among other things, on ...

    • The Ontology based FMEA of Lead Free Soldering Process 

      Autor: Molhanec, Martin; Mach, Pavel; Mensah, David Asamoah Bamfo
      (IEEE, 2010-05)
      Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the field of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools, suitable for our intention, ...

    • The Ontology based FMEA of Lead Free Soldering Process 

      Autor: Molhanec, Martin; Mach, Pavel
      (IEEE, 2009-05)
      Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the area of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools suitable for our intention ...

    • Thermal Ageing of Electrically Conductive Micro/Nano Adhesives 

      Autor: Mach, Pavel; Bušek, David
      (IEEE, 2010-09)
      Electrical as well as mechanical properties of electrically conductive adhesives can be modified by addition of different types of nanoparticles. It has been investigated if changes of the resistance of adhesive joints ...

    • Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive 

      Autor: Bušek, David; Pilarčíková, Ivana; Mach, Pavel
      (IEEE, 2010-05)
      Mechanical properties of isotropically conductive adhesives depend not just on the internal structure and composition (amount and type of binder and filler) of the adhesive, but also on chemical processes that are influenced ...

    • Thermomechanical Analysis of Electrically Conductive Adhesives 

      Autor: Mach, Pavel; Bušek, David; Polanský, Radek
      (IEEE, 2010-09)
      Mechanical properties of isotropic electrically conductive adhesives (ICAs) are mainly influenced by their formulation and thermal processing. Thermomechanical analysis of ICAs was used with the goal to find influence of ...

    • Tolerance Design of Curing Process of Electrically Conductive Adhesives 

      Autor: Barto, Seba; Mach, Pavel
      (IEEE, 2010-05)
      The work was directed at examination of influence of tolerances of curing process parameters on the tolerances of the resistance and nonlinearity of a current vs. voltage characteristic of adhesive joints. The joints were ...

    • Transformation of Data for Statistical Processing 

      Autor: Mach, Pavel; Thuring, Josef; Šámal, David
      (IEEE, 2006-05)
      The use of many statistical tools depends on normality of processed data. There are different methods for transformation of non-normally distributed data sets toward to normally distributed ones. The goal of the work has ...

    • Transient Effects on High Voltage Diode Stack under Reverse Bias 

      Autor: Papež, V.; Kojecký, B.; Kožíšek, J.; Hejhal, J.
      (2003)
      This article deals with a description and analysis of the fast transient processes which can occur during a local non-destructive breakdown in a circuit arranged by serial connection of reverse biased high-voltage silicon ...