Prohlížení Publikační činnost - 13113 dle názvu
Zobrazují se záznamy 6-25 z 60
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Degradation of Adhesive Bonds with Short Current Pulses
(IEEE, 2003-05)Degradation of adhesive bonds powered by rectangular very short current pulses of the width of 1 μs and frequency of 1 kHz of high amplitude has been examined. The amplitudes of the pulses have been 5 and 10 A. Power ... -
Design of Experiments of AlN Reactive Sputtering
(IEEE, 2009-05)Reactive sputtering has been used for fabrication of AlN films. The process has been investigated in two levels of power of a generator, in two levels of the working pressure and in two levels of the working gas flow. The ... -
Diagnostic Tools for Evaluation of the Quality of the Anisotropic Conductive Adhesive Joints
(IEEE, 2006-05)Isotropic and anisotropic electrically conductive adhesives (ICAs and AC As) are materials for special applications in electronic assembly. Quality of these adhesive joints is evaluated according of their electrical and ... -
Diagnostics and Aging of Electrically Conductive Adhesives
(IEEE, 2000)Resistance and nonlinearity of the current vs. voltage characteristics (NAVC) of adhesive joints was investigated. The joints were prepared of four types of electrically conductive adhesives (ECA) on Cu clad FR4 laminate ... -
Dielectric properties of plasma sprayed titanates
(2001)This paper presents the study of the dielectric properties of three plasma-deposited titanates. The deposits were prepared from powders with the same starting composition as industrially produced dielectric ceramics. ... -
Dielectric relaxation in calcium titanate-containing ceramics prepared by plasma spraying
(2003)The relative permittivity and loss factor frequency dependence in a weak electric field of plasma sprayed perovskite and ilminite polycrystalline ceramic materials—pure synthetic calcium titanate, as well as magnesium ... -
Electrical Connection Network Within an Electrically Conductive Adhesive
(IEEE, 2008-05)This paper deals with the connection network in isotropically conductive adhesives (ICAs). The reader will learn about conductive network creation, tunneling effect, possible ways of modeling the conductive network and ... -
Electrically Conductive Adhesive Filled with Mixture of Silver Nano and Microparticles
(IEEE, 2008-09)Electrically conductive adhesive with isotropical electrical conductivity modified with addition of silver nanoparticles has been investigated. The electrical resistance, nonlinearity of a current vs. voltage characteristic ... -
Electrically Loaded Adhesive Bonds Formed on Different Surfaces
(IEEE, 2007-05)Bonds of three types of electrically conductive adhesives with isotropic electrical conductivity have been formed on three types of surfaces - Cu; immerse Au and Sn (HAL). Epoxy resin types of adhesives with Ag flakes have ... -
Equipment for measurement of nonlinearity of nominally linear components
(IEEE, 2006-05)Nonlinearity of a nominally linear component is a significant parameter, which informs about the difference of and investigated component from an ideal one. The higher is quality of the nominally linear component; the lower ... -
An evaluation of the influence of a magnetic field on a human subject with the use of bio-impedance
(2010)The influence of a magnetic field on a living human organism was monitored using a bio-impedance evaluation of vasodilatation effects. A quantitative evaluation of the influence of a magnetic field on a human being was ... -
Fabrication of AI203 and AIN thin films by reactive sputtering and its optimization using DOE
(IEEE, 2004-05)Thin films of Al2O3 and AlN have been fabricated by reactive sputtering using magnetron sputtering equipment. A mixture of Ar and O2 has been used for the fabrication of Al2O3 films, and a mixture of Ar and N2 has been ... -
Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering
(IEEE, 2008-05)There are many methods usable for production process optimization. The paper describes the use of failure mode and effects analysis (FMEA of a process type) for the process of lead-free soldering improvement. The schedule ... -
Flux effect on void quantity and size in soldered joints
(2016)This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes ... -
Frequency Dependence of Impedance of Adhesive Joints
(IEEE, 2006-09)Electrically conductive adhesives have, in comparison with solders, significantly higher non-homogeneity of the structure, and therefore stability of electrical as well as mechanical properties of adhesive joints is lower ... -
Impedance of Adhesive Joints
(IEEE, 2009-09)Impedance of adhesive joints has been measured in frequency range 20 Hz - 1 MHz using LCR meter HP 4284A. The joints have been created by adhesive assembly of jumpers on test PCBs. It has been found that the joint impedance ... -
Influence of Carbon Nanotubes Added to a Commercial Adhesive
(IEEE, 2009-05)This paper describes the influence of carbon nanotubes onto electrical properties of electrically conductive adhesives. This work is related to our previous research that described electrical connection network within ... -
Influence of chemical composition on dielectric properties of Al2O3 and ZrO2 plasma deposits
(2003)Aluminum oxide, zirconium oxide and their mixture were plasma sprayed by a water-stabilized plasma gun. Resulting deposits were studied as dielectrics. Capacity and loss factor were measured for the frequency range 200–106 ... -
Influence of Curing Process Parameters on Quality of Electrically Conductive Joints
(IEEE, 2010-05)Curing parameters of electrically conductive adhesives are the temperature and the time. These parameters are recommended by a manufacturer of adhesive. The goal of the work is to find which of these parameters is more ... -
Influence of High Current Load on Electrical Properties of Adhesive Conductive Joints
(IEEE, 2006-09)Isotropic and anisotropic electrically conductive adhesives (ICAs and ACAs) are alternative materials for substitution of common used tin-lead solders in electronic assembly. Electrically conductive adhesives are potential ...