• LABORATORY TESTING OF THE LEICA AT401 LASER TRACKER 

      Autor: Dvořáček , Filip
      (České vysoké učení technické v PrazeCzech Technical University in Prague, 2016)
      This paper describes laboratory tests on a Leica AT401laser tracker. As the newer Leica AT402 model also uses the same firmware package, most of the results should also be valid for this device. First, we present the ...
    • MEASUREMENTS ON THE VT 400 AIR TURBINE 

      Autor: Klimko , Marek; Okresa , Daniel
      (České vysoké učení technické v PrazeCzech Technical University in Prague, 2016)
      This paper presents a basic description of measurements on the experimental air turbine located in the laboratories of the Department of Power System Engineering (KKE). The research on this turbine focuses on the flow in ...
    • PARAMETRIC STUDIES ON THE COMPONENT-BASED APPROACH TO MODELLING BEAM BOTTOM FLANGE BUCKLING AT ELEVATED TEMPERATURES 

      Autor: Quan , Guan; Huang , Shan-Shan; Burgess , Ian
      (České vysoké učení technické v PrazeCzech Technical University in Prague, 2016)
      In this study, an analytical model of the combination of beam-web shear buckling and bottom-flange buckling at elevated temperatures has been introduced. This analytical model is able to track the force-deflection path ...
    • TESTS ON 10.9 BOLTS UNDER COMBINED TENSION AND SHEAR 

      Autor: Kawohl Katherine, Anne; Lange , Jörg
      (České vysoké učení technické v PrazeCzech Technical University in Prague, 2016)
      Prior investigations of the load-bearing capacity of bolts during fire have shown differing behaviour between bolts that have been loaded by shear or by tensile loads. A combination of the two loads has not yet been examined ...
    • ULTRASONIC SOLDERING OF Cu AND Al2O3 CERAMICS BY USE OF Bi-La AND Bi-Ag-La SOLDERS 

      Autor: Koleňák , Roman; Prach , Michal; Kostolný , Igor
      (České vysoké učení technické v PrazeCzech Technical University in Prague, 2016)
      This work deals with the effect of solder alloying with a small amount of lanthanum on joint formation with metallic and ceramic substrate. The Bi-Ag – based solder with 2 wt.% lanthanum addition and Bi solder with 2 wt.% ...