• The Process of Plasma Chemical Photoresist Film Ashing from the Surface of Silicon Wafers 

      Autor: Bordusau , Siarhei; Madveika , Siarhei; Dostanko , Anatolii
      (České vysoké učení technické v PrazeCzech Technical University in Prague, 2013)
      At present, the research for finding new technical methods of treating materials with plasma, including the development of energy and resource saving technologies for microelectronic manufacturing, is particularly actual.In ...